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Process Capability

PCB Manufacturing Capability
CategoryItemStandardAdvance
BasicRigid PCB Layer Count1-36L60L
Flex & Rigid-Flex PCB Layer CountFlex PCB: 1-10LFlex PCB: 1-16L
Rigid-flex PCB: 2-20LRigid-flex PCB+HDI: 2-20L
Min. Fnished Board Thickness0.2 ± 0.05mm(8 ± 2mil)0.15 ± 0.025mm(6 ± 1mil)
Max. Fnished Board Thickness6.5 ± 10%mm(256 ± 10%mil)10.0 ± 10%mm(394 ± 10%mil)
Max.Board/Array Size1060mm*610mm(41*24inch)1100mm*660mm(43*26inch)
Min. Core Thickness0.05mm(2mil)0.034mm(1.34mil)
StackupThrough-hole PCBYESYES
Mechanical-Blind/buried via PCBYESYES
Metal Base PCBYESYES
HDI1+N+1Rigid-flex PCB+HDI
1+1+N+1+1,2+N+2
1+1+1+N+1+1+1,3+N+3
Anylayer
Base materialNormal Tg, Middle Tg, High TgYesYes
Lead Free,Halogen FreeYesYes
Low Dk LaminateYesYes
Low Loss LaminateYesYes
High Frequency LaminateYesYes
PI LaminateYesYes
BT LaminateYesYes
Teflon LaminateYesYes
Material supplierShengyi, ITEQ, KB, TUC, GraceYesYes
Isola, Ventec, Nanya, Dopont
Arlon, Rogers, Wangling, Taconic
Bergquist, Boyu, Nelco
HoleMin. Mechanical Drill Size0.15mm(6mil)0.10mm(4mil)
Min. Laser Drill Size0.10mm(4mil)0.075mm(3mil)
Drilling Hole to Hole Accuracy± 0.05mm(± 2mil)± 0.05mm(± 2mil)
PTH Tolerance± 0.075mm(± 3mil)± 0.05mm(± 2mil)
NPTH Tolerance± 0.05mm(± 2mil)± 0.038mm(± 1.5mil)
Controlled Depth Drilling Tolerance± 0.10mm(± 4mil)± 0.05mm(± 2mil)
PTH Aspect Ratio10:115:1
Laswer Aspect Ratio0.8:11:1
Min. Distance of hole to trace7mil6.5mil
Trace, SoldermaskMin. Trace Width/Space0.075mm/0.075mm(3/3mil)0.05mm/0.05mm(2/2mil)
Trace Width Tolerance± 10%± 8%
Min. Base Cu Thickness12um(1/3 oz )9um(1/4 oz )
Max. Base Cu Thickness12 oz12 oz
Impedance Control Tolerance± 10%± 5%
Registration<10L± 0.05mm(± 2mil)± 0.038(± 1.5mil)
Registration≥10L± 0.075(± 3mil)± 0.05(± 2mil)
Min. SMT/QFP Pitch0.20mm(8mil)0.15mm(6mil)
Min. BGA Pitch0.23mm(9mil)0.20mm(8mil)
Min. Solder Bridge Width3mil3mil
S/M Registration Tolerance± 0.05mm(± 2mil)± 0.038mm(± 1.5mil)
MechanicalRouting Tolerance± 0.13mm(± 5mil)± 0.10mm(± 4mil)
Punch Tolerance± 0.10mm(± 4mil)± 0.05mm(± 2mil)
V-cut Location Tolerance± 0.10mm(± 4mil)± 0.075mm(± 3mil)
V-cut Residual Tolerance± 0.10mm(± 4mil)± 0.05mm(± 2mil)
Angle & Tolerance of Beveling of G/F20°/30°/45°, ± 5°20°/30°/45°, ± 5°
Depth & Tolerance of Beveling of G/F1.2 ± 0.20mm(47 ± 8mil)1.2 ± 0.10mm(47 ± 4mil)
Surface Finishing
Carbon inkNipon 
Peelable MaskPETER SD2955 
OSPEntek Plus HT; Preflux F2 LX 
ENIGAu: 0.03um -0.06um, Ni: 3um -6um 
ENIG+OSPYes 
Immersion Tin0.8-1.2um 
Immersion SilverYes 
HASL(Free)0.5-40um 
ENEIPGAu: 0.015-0.075um; Pd: 0.02-0.075um; Ni: 2-6um
Electro. Hard GoldAu: 0.125-1.270um; Ni: 2.50-6.25um 
Special ProcessPlatd edgeYesYes
Half HoleYesYes
Sidestep holeYesYes
Via in PadYesYes
Back DrillYesYes
Countersink HoleYesYes
Advanced
Buried CapacitorYesYes
Buried ResistorYesYes
Embedded coinYesYes
Rigid-FlexYesYes
Rigid-Flex + HDIYesYes
SubstrateNoNo
Rigid-Flex + Metal BaseNoNo