Process Capability
|
PCB Manufacturing Capability |
|||
|
Category |
Item |
Standard |
Advance |
|
Basic |
Rigid PCB Layer Count |
1-36L |
60L |
|
Flex & Rigid-Flex PCB Layer Count |
Flex PCB: 1-10L |
Flex PCB: 1-16L |
|
|
Rigid-flex PCB: 2-20L |
Rigid-flex PCB+HDI: 2-20L |
||
|
Min. Fnished Board Thickness |
0.2 ± 0.05mm(8 ± 2mil) |
0.15 ± 0.025mm(6 ± 1mil) |
|
|
Max. Fnished Board Thickness |
6.5 ± 10%mm(256 ± 10%mil) |
10.0 ± 10%mm(394 ± 10%mil) |
|
|
Max.Board/Array Size |
1060mm*610mm(41*24inch) |
1100mm*660mm(43*26inch) |
|
|
Min. Core Thickness |
0.05mm(2mil) |
0.034mm(1.34mil) |
|
|
Stackup |
Through-hole PCB |
YES |
YES |
|
Mechanical-Blind/buried via PCB |
YES |
YES |
|
|
Metal Base PCB |
YES |
YES |
|
|
HDI |
1+N+1 |
Rigid-flex PCB+HDI |
|
|
1+1+N+1+1,2+N+2 |
|||
|
1+1+1+N+1+1+1,3+N+3 |
|||
|
Anylayer |
|||
|
Base material |
Normal Tg, Middle Tg, High Tg |
Yes |
Yes |
|
Lead Free,Halogen Free |
Yes |
Yes |
|
|
Low Dk Laminate |
Yes |
Yes |
|
|
Low Loss Laminate |
Yes |
Yes |
|
|
High Frequency Laminate |
Yes |
Yes |
|
|
PI Laminate |
Yes |
Yes |
|
|
BT Laminate |
Yes |
Yes |
|
|
Teflon Laminate |
Yes |
Yes |
|
|
Material supplier |
Shengyi, ITEQ, KB, TUC, Grace |
Yes |
Yes |
|
Isola, Ventec, Nanya, Dopont |
|||
|
Arlon, Rogers, Wangling, Taconic |
|||
|
Bergquist, Boyu, Nelco |
|||
|
Hole |
Min. Mechanical Drill Size |
0.15mm(6mil) |
0.10mm(4mil) |
|
Min. Laser Drill Size |
0.10mm(4mil) |
0.075mm(3mil) |
|
|
Drilling Hole to Hole Accuracy |
± 0.05mm(± 2mil) |
± 0.05mm(± 2mil) |
|
|
PTH Tolerance |
± 0.075mm(± 3mil) |
± 0.05mm(± 2mil) |
|
|
NPTH Tolerance |
± 0.05mm(± 2mil) |
± 0.038mm(± 1.5mil) |
|
|
Controlled Depth Drilling Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
|
|
PTH Aspect Ratio |
10:1 |
15:1 |
|
|
Laswer Aspect Ratio |
0.8:1 |
1:1 |
|
|
Min. Distance of hole to trace |
7mil |
6.5mil |
|
|
Trace, Soldermask |
Min. Trace Width/Space |
0.075mm/0.075mm(3/3mil) |
0.05mm/0.05mm(2/2mil) |
|
Trace Width Tolerance |
± 10% |
± 8% |
|
|
Min. Base Cu Thickness |
12um(1/3 oz ) |
9um(1/4 oz ) |
|
|
Max. Base Cu Thickness |
12 oz |
12 oz |
|
|
Impedance Control Tolerance |
± 10% |
± 5% |
|
|
Registration＜10L |
± 0.05mm(± 2mil) |
± 0.038(± 1.5mil) |
|
|
Registration≥10L |
± 0.075(± 3mil) |
± 0.05(± 2mil) |
|
|
Min. SMT/QFP Pitch |
0.20mm(8mil) |
0.15mm(6mil) |
|
|
Min. BGA Pitch |
0.23mm(9mil) |
0.20mm(8mil) |
|
|
Min. Solder Bridge Width |
3mil |
3mil |
|
|
S/M Registration Tolerance |
± 0.05mm(± 2mil) |
± 0.038mm(± 1.5mil) |
|
|
Mechanical |
Routing Tolerance |
± 0.13mm(± 5mil) |
± 0.10mm(± 4mil) |
|
Punch Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
|
|
V-cut Location Tolerance |
± 0.10mm(± 4mil) |
± 0.075mm(± 3mil) |
|
|
V-cut Residual Tolerance |
± 0.10mm(± 4mil) |
± 0.05mm(± 2mil) |
|
|
Angle & Tolerance of Beveling of G/F |
20°/30°/45°, ± 5° |
20°/30°/45°, ± 5° |
|
|
Depth & Tolerance of Beveling of G/F |
1.2 ± 0.20mm(47 ± 8mil) |
1.2 ± 0.10mm(47 ± 4mil) |
|
|
Surface Finishing |
Carbon ink |
Nipon |
|
|
Peelable Mask |
PETER SD2955 |
|
|
|
OSP |
Entek Plus HT; Preflux F2 LX |
|
|
|
ENIG |
Au: 0.03um -0.06um, Ni: 3um -6um |
|
|
|
ENIG+OSP |
Yes |
|
|
|
Immersion Tin |
0.8-1.2um |
|
|
|
Immersion Silver |
Yes |
|
|
|
HASL(Free) |
0.5-40um |
|
|
|
ENEIPG |
Au: 0.015-0.075um; Pd: 0.02-0.075um; Ni: 2-6um |
||
|
Electro. Hard Gold |
Au: 0.125-1.270um; Ni: 2.50-6.25um |
|
|
|
Special Process |
Platd edge |
Yes |
Yes |
|
Half Hole |
Yes |
Yes |
|
|
Sidestep hole |
Yes |
Yes |
|
|
Via in Pad |
Yes |
Yes |
|
|
Back Drill |
Yes |
Yes |
|
|
Countersink Hole |
Yes |
Yes |
|
|
Advanced |
Buried Capacitor |
Yes |
Yes |
|
Buried Resistor |
Yes |
Yes |
|
|
Embedded coin |
Yes |
Yes |
|
|
Rigid-Flex |
Yes |
Yes |
|
|
Rigid-Flex + HDI |
Yes |
Yes |
|
|
Substrate |
No |
No |
|
|
Rigid-Flex + Metal Base |
No |
No |
|