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High-speed PCB

Your Professional High-speed PCB Manufacturer！

 

Shenzhen Tontek Circuits Co., Ltd, one of China's leading printed circuit board (PCB) manufacturers, was founded in 2006. The company has established core product advantages in high-density interconnect (HDI) PCBs, any-layer HDI PCBs, multilayer PCBs, high-frequency PCBs, high-speed PCBs, RF antenna PCBs, and ultra-fast storage SSDs.

 

 
  • Heavy Copper PCB
    Heavy Copper PCB
    A Heavy Copper PCB is a printed circuit board where the conductive layer (typically copper foil) is significantly thicker than that of standard PCBs. Standard PCBs typically have copper weights...
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  • Halogen-Free PCB
    Halogen-Free PCB
    A Halogen-Free PCB is an eco-friendly printed circuit board that excludes chlorine (Cl), bromine (Br), and other halogen elements, defined by:
    1. Material Composition:
    Halogen...
    read more
  • Blind And Buried Via PCB
    Blind And Buried Via PCB
    A Blind & Buried Via PCB is a type of High-Density Interconnect (HDI) Printed Circuit Board that utilizes special via structures different from traditional through-hole vias (which go through the...
    read more
  • HDI Circuit Board
    HDI Circuit Board
    HDI PCB (High-Density Interconnect Printed Circuit Board) is a type of printed circuit board manufactured using advanced fine-line technology. Its defining characteristic is significantly higher...
    read more
  • High-speed Transmission PCB
    High-speed Transmission PCB
    High-Speed PCB refers to printed circuit boards engineered for transmitting high-speed digital signals (typically ≥1GHz) or high-frequency analog signals (≥100MHz), High-Speed PCBs balance time...
    read more
  • Semiconductor Test Board
    Semiconductor Test Board
    A semiconductor test board (Load Board) is a high-precision interface substrate designed for IC mass production testing and characterization, featuring:
    1. Electrical interfacing between...
    read more
  • Semiconductor Test PCB
    Semiconductor Test PCB
    An Any-Layer HDI PCB is the most technologically advanced and complex type of High-Density Interconnect (HDI) printed circuit board. Its defining characteristic is the use of any-layer...
    read more
  • High-frequency High-speed PCB
    High-frequency High-speed PCB
    High-Frequency High-Speed PCB refers to a special type of printed circuit board specifically designed for transmitting and processing high-frequency signals (typically above 1GHz) and high-speed...
    read more
  • AI Server PCB
    AI Server PCB
    An AI Server Circuit Board (typically referring to the motherboard) is a specialized printed circuit board (PCB) designed and optimized specifically for running artificial intelligence (AI)...
    read more
  • Communication Equipment PCB
    Communication Equipment PCB
    A Communication Equipment Circuit Board is the core component of electronic devices used for information transmission, reception, and processing. It is a printed circuit board (PCB) populated with...
    read more
  • Protruding Copper PCB
    Protruding Copper PCB
    Protruding Copper PCB refers to a specialized circuit board featuring localized 3D copper structures (50-200μm above the conductor plane) created via selective plating or etching. Its core...
    read more
  • High-Temperature Polyimide PCB
    High-Temperature Polyimide PCB
    High-Temperature Polyimide PCB is a specialized printed circuit board using polyimide (PI) as the substrate material. Its defining capability is maintaining electrical and mechanical stability...
    read more
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Why Choose Us
Our Factory
With its marketing center located in Shenzhen, the company operates one PCB design center, two PCB manufacturing plants, and one SMT assembly factory, situated in Nanchang, Jiangmen, and Shenzhen respectively.
Quality Assurance
In terms of quality assurance, the company strictly follows the standards and norms of the industry quality system. Adopt industry-leading testing equipment to ensure product quality and good reputation.
Our Certificate
We has ISO9001, ISO14001, ISO13485, IATF16949 and UL approved.

 

Item Project Advanced samples Mass production
1 Material Type Normal FR-4 SYST S1141 SYST S1141
2 Tg FR-4 SYST S1000H SYST S1000H
3 Halogen-Free Mid-Tg FR4 SYST S1150G SYST S1150G
4 Halogen-Free High-Tg FR4 SYST S1170 SYST S1170
5 High CTI SYST S1600L/Autolad2G SYST S1600L/Autolad2G
6 High Tg FR4(High TG) IT180A 、S1000-2M 、FR408 、IS410 、FR406 、PCL-370HR 、TU-752 、TU-
662（Taiyao) and other equivalent brand materials .		 IT180A 、S1000-2M 、FR408 、IS410 、FR406 、PCL-370HR 、TU-752
TU-662（（Taiyao) and other equivalent brand materials .
7 High Speed Laminates Middle loss(M4 、TU872SLK 、IT958) 、Low loss(M6 、TU883 、IT968) 、Ultra low loss(M7 、TU993 、IT933), Isola ect.. Low loss(M4 、TU872SLK 、IT958) 、Middle loss(M6 、TU883 、IT968)、Ultra low loss(M7 、TU993 、IT933), Isola ect..
8 Ceramic-Filled High-Frequency Materials (Brand or Model) Rogers4350B 、Rogers4003 、TMM 、25FR 、25N 、S7136H Rogers4350B 、Rogers4003 、TMM、25FR 、25N 、S7136H
9 PTFE High-Frequency Materials (Brand or Model) Rogers、Taconic 、Arlon 、Nelco、F4BK Rogers、Taconic、Arlon、Nelco、F4BK
10 Mixed Materials (Brand or Model) Rogers 、Taconic 、Arlon 、Nelco and FR-4 hybrid lamination Rogers 、Taconic 、Arlon 、Nelco and FR-4 hybrid lamination
11 Prepreg (Brand or Model) Rogers4450F、Arlon 49N、Arlon38N(106)、Arlon99ML(1080)、ST115B(106)、FR-28、S6B、VT-47NF、PP(SF305B 25) Rogers4450F、Arlon 49N、Arlon38N(106)、Arlon99ML(1080)、ST115B(106)、FR-28、S6B、VT-47NF、PP(SF305B 25)
14 HDI Board Material Type RCC、PP 106 and 1080 RCC、PP 106 and 1080
15 Product Type Rigid Backplanes, HDI, Multilayer Boards with Buried/Blind Vias, Power Boards with Heavy Copper, Back Drilling, Metal Base, Metal Core, Embedded Copper, Busbars, Local Hybrid Lamination, Step Boards Backplanes, HDI, Multilayer Boards with Buried/Blind Vias, Power Boards with Heavy Copper, Back Drilling, Metal Base, Metal Core, Embedded Copper, Busbars, Local Hybrid Lamination, Step Boards
16 Stack-up Blind/Buried Via Types Up to 3 sequential lamination cycles (excluding via-in-pad) Up to 2 sequential lamination cycles (excluding via-in-pad)
17 Minimum Dielectric Thickness Inner Flexible Core 0.0125mm Inner Flexible Core 0.025mm
Inner Rigid Core 0.05mm Inner Rigid Core 0.1mm
Prepreg 0.05mm Prepreg 0.075mm
18 Rigid-Flex Stack-up Structures Multiple Flexible Layers (flex in inner layers), Flex on Top/Bottom Layers, Single Flexible Layer (Tail Structure) Multiple Flexible Layers (flex in inner layers), Flex on Top/Bottom Layers, Single Flexible Layer (Tail Structure)
19 HDI Types Any-layer Interconnect 3+N+3
20 Surface Finish Lead-Free Lead-Free HASL (Board Thickness 0.4mm-4.5mm), Electrolytic Nickel/Gold (Base Copper Thickness ≤ 1oz), ENIG, Immersion Tin, Immersion Silver, OSP, Hard Gold Plating (with/without Nickel), Soft Gold Plating (with/without Nickel), ENIG+OSP, Electroless Nickel Palladium Gold (ENEPIG) Lead-Free HASL (Board Thickness 0.4mm-4.5mm), Electrolytic Nickel/Gold (Base Copper Thickness ≤ 1oz), ENIG, Immersion Tin, Immersion Silver, OSP, Hard Gold Plating (with/without Nickel), Soft Gold Plating (with/without Nickel), ENIG+OSP, Electroless Nickel Palladium Gold (ENEPIG)
Lead-Based Lead-Based HASL (Board Thickness 0.4mm-4.5mm) Lead-Based HASL (Board Thickness 0.4mm-4.5mm)
Rigid-Flex Products Electroless Nickel/Gold (+ Hard Gold Fingers), OSP, Immersion Silver, Immersion Tin, Electroless Nickel Palladium Gold Electroless Nickel/Gold (+ Hard Gold Fingers), OSP, Immersion Silver, Immersion Tin, Electroless Nickel Palladium Gold
21 Coverlay Thickness Hot Air Solder Leveling (HASL) 2-40um 2-40um
22 Immersion Gold (ENIG) Nickel Thickness ：2.5-8um ；Gold Thickness ：0.05-0.2um Nickel Thickness ：2.5-8um ；Gold Thickness：0.05-0.2um
23 Immersion Soft Gold Nickel Thickness ：1.27um ; Gold Thickness：0.05-0.2um Nickel Thickness ：1.27um ; Gold Thickness：0.05-0.2um
24 Immersion Tin 0.76-1um 0.76-1um
25 Immersion Silver 0.2-0.4um 0.2-0.4um
26 Anti-Oxidation (OSP) 0.1-0.3um 0.1-0.3um
27 Hard Gold Plating 0.05-2.0um 0.05-2.0um
28 Soft Gold Plating 0.05-5.0um 0.05-5.0um
29 Electroless Nickel Palladium Gold (ENEPIG) Nickel Thickness ：3-8um ；Pb ：0.05-0.10um Gold ：0.05-0.10um Nickel Thickness ：3-8um ；Pb ：0.05-0.10um Gold：0.05-0.10um
30 Carbon Ink 10-35um 10-35um
31 Solder Mask 10-18um（Solder Mask on Copper）， 5-8um（Tenting Vias）， Trace Corner≥10um（Single Print） 10-18um（Solder Mask on Copper）， 5-8um（Tenting Vias）， Trace Corner≥10um（Single Print）
32 Blue Mask peters-SD2955 peters-SD2955
0.20-0.80mm 0.20-0.80mm
33 Holes Finished Mechanical Hole Diameter 0.08-6.5mm (using drill bits 0.125-6.5mm) 0.10-6.5mm (using drill bits 0.15-6.5mm)
34 Mechanical Blind/Buried Via Diameter ≤0.60mm Mechanical Blind/Buried Via Diameter ≤0.60mm
35 Heavy Copper ( ≥3OZ）: Min. 0.3mm (using drill bits ≤0.35mm) Heavy Copper ( ≥3OZ）: Min. 0.4mm (using drill bits ≤0.4mm)
36 Aluminum Base: Min. 0.8mm (using drill bits ≤0.90mm) Aluminum Base: Min. 0.8mm (using drill bits ≤0.90mm)
37 Interconnected Holes: Min. 0.4mm (using drill bit 0.5mm) Interconnected Holes: Min. 0.4mm (using drill bit 0.5mm)
38 Plated Half-Holes (Finished): Min. 0.40mm (using drill bit 0.50mm) Plated Half-Holes (Finished): Min. 0.40mm (using drill bit 0.50mm)
39 Drill Size vs. Board Thickness Relationship: 0.15mm≤Drill Size≤6.0mm;
Hole 0.15mm: Max board thickness 1.4mm;
Hole 0.2mm: Max board thickness 2.0mm;
Hole 0.25mm≤Ф≤0.35mm: Max board thickness 3.2mm;
Hole 0.4mm≤Ф≤0.55mm: Max board thickness 4.8mm;
Hole >0.55mm: Max board thickness 6.4mm		 0.15mm≤Drill Size≤6.0mm;
Hole 0.15mm: Max board thickness 1.2mm;
Hole 0.2mm: Max board thickness 2.0mm;
Hole 0.25mm≤Ф≤0.35mm: Max board thickness 3.2mm;
Hole 0.4mm≤Ф≤0.55mm: Max board thickness 4.8mm;
Hole >0.55mm: Max board thickness 6.4mm
40 Max Board Thickness to Drill Ratio for Through Holes: 25:1 (for drill size >0.2mm) Max Board Thickness to Drill Ratio for Through Holes: 12:1 (for drill size >0.2mm) (for drill size 0.2mm: 10:1)
41 Hole Position Tolerance (Compared to CAD Data) ±2mil ±3mil
42 PTH Hole Size Tolerance ±3mil ±3mil
43 Press-Fit Hole Tolerance (Solderless Components) ±2mil ±2mil
44 NPTH Hole Size Tolerance ±2mil（Limit:+0/-2mil or +2/-0mil） ±2mil
45 Finished Hole Size Range for Resin Filled Holes 0.1-0.9mm (Drill 0.15-1.0mm)
(Board thickness ≥0.5mm required when drill size >0.5mm)		 0.1-0.9mm (Drill 0.15-1.0mm)
(Board thickness ≥0.7mm required when drill size >0.5mm)
46 Max. Aspect Ratio (Board Thickness/Drill Size) for Resin Filling 25:1 10:1
47 Min. Line Width/Spacing for Resin Filled Areas 3/4mil (line-line) ；3/3.5mil (line-pad, pad-pad) 3/4mil(line-line) ；3/3.5mil (line-pad, pad-pad)
48 Laser Drilling Min Hole Size: 0.070mm (Max depth/diameter ratio ≤1:1) Min Hole Size: 0.10mm (Max depth/diameter ratio ≤1:1)
49 Blind Via Max Depth/Diameter Ratio 1:1 1.15:1
50 Back Drilling Min Depth 0.2mm 0.2mm
51 Back Drill Diameter 0.3-6.5mm 0.4-6.5mm
52 Back Drill Insulation Thickness (Target Layer to Next Layer) ≥0.20mm ≥0.20mm
53 Back Drill Depth Tolerance ±0.1mm ±0.1mm
54 Tapered Hole & Stepped Hole Angle and Diameter Special Bits: 82°/90°/120°/135° (Tapered drill range: 0.3-10mm) Special Bits: 82°/90°/120°/135° (Tapered drill range: 0.3-10mm)
55 Standard Bits: 130° (Drill ≤3.175mm), 165° (Drill 3.175-6.5mm) Standard Bits: 130° (Drill ≤3.175mm), 165° (Drill 3.175-6.3mm)
56 Angle Tolerance ± 10° ± 10°
57 Tapered & Stepped Hole Entrance Diameter Tolerance ±0.15mm ±0.15mm
58 Tapered & Stepped Hole Depth Tolerance ±0.15mm ±0.15mm
59 Special-Shaped Slot Tolerance (Milled Slot) ±0.10mm ±0.13mm
60 Depth-Controlled Milled Slot (Edge) Depth Accuracy (NPTH) ±0.15mm ±0.15mm
61 Min. Slot Tolerance (Drilled Slot) NPTH: L/W≥2: ±0.1mm; L/W<2: ±0.15mm NPTH: L/W≥2: ±0.1mm; L/W<2: ±0.15mm
62 PTH: L/W≥2: ±0.1mm; L/W<2: ±0.15mm PTH: L/W≥2: ±0.1mm; L/W<2: ±0.15mm
63 Min. Slot Tolerance (Milled Slot) NPTH: ±0.10mm; PTH: ±0.13mm NPTH: ±0.10mm; PTH: ±0.13mm
64 Aspect Ratio Mechanical Through Holes ＜30:1 Mechanical Through Holes ＜12:1
64 Laser Blind Vias ＜0.8:1 Laser Blind Vias ＜1:1
65 Pad( Annular Ring) Minimum Aperture (Laser) / Pad 4/10mil ；5/11mil 4/12mil ；5/13mil
66 Minimum Aperture (Mechanical) / Pad 4/10mil ; 5/11mil ; 6/12mil 6/14mil ; 8/16mil
67 Minimum BGA Pad Diameter 8mil 10mil（EnIg: 8mil）
68 Pad Tolerance +/-1.5mi（PAD≤10mil） ；+/-10%（PAD>10mil) +/-1.5mi（PAD≤10mil） ；+/-10%（PAD>10mil)
69 Line Width/Spacing Capability Inner Layer 0.5OZ ≥2.5/2.5mil 0.5OZ ≥3/3mil
70 1oz ≥3.5/3.5mil 1oz ≥4/4.5mil
71 2OZ ≥5/6mil 2OZ ≥4.5/7mil
72 3OZ; ≥6/8mil 3OZ; ≥7/9mil
73 4OZ ≥7/10 mil 4OZ ≥8/11 mil
74 5OZ ≥8/12 mil 5OZ ≥9/13 mil
75 6OZ ≥9/14 mil 6OZ ≥ 10/15 mil
76 max 2OZ Same as above for line width/spacing max 1OZ Same as above for line width/spacing
77 Outer Layer (Copper thickness refers to finished copper thickness) 0.5OZ ≥3/3mil 0.5OZ ≥3.5/4mil
78 1oz ≥3/3.5 mil or locally 3/3 mil 1oz ≥4/5mil
79 2OZ ≥5/6mil 2OZ ≥5/7mil
80 3OZ ≥6/8 mil 3OZ ≥6/9mil
81 4OZ ≥7/10 mil 4OZ ≥7/11mil
82 5OZ ≥8/12 mil 5OZ ≥9/13mil
83 6OZ ≥9/14 mil 6OZ ≥ 10/15mil
84 0.5-2OZ Same as above for line width/spacing 0.5-1OZ Same as above for line width/spacing
85 Line Width Tolerance ≤ 10mil ：± 10% ≤ 10mil ：± 1.5mil
86 >10mil ：±0.8mil >10mil ：±2mil， 局部± 1mil ；>10mil ：±2mil， patrial ± 1mil
87 Spacing Minimum Distance from Drill Hole to Conductor (Mechanical Buried/Blind Via Boards) 7mil (1x lamination); 8.5mil (2x lamination); 10mil (3x lamination) 8mil (1x lamination); 9mil (2x or 3x lamination)
88 Minimum Distance from Drill Hole to Conductor (Non-Buried/Blind Via) 6.5mil (≤8 layers); 7.5mil (10-14 layers); 8mil (>14 layers) 7mil (≤8 layers); 9mil (>8 layers)
Rigid-Flex PCB 7mil Rigid-Flex PCB 8mil
89 Minimum Distance from Laser Drill Hole to Conductor (1-step HDI Boards) 7mil 8mil
90 Minimum Distance from Outer Layer Trace to Routing Edge (No Copper Exposure) 8mil 10mil
91 Minimum Distance from V-CUT Centerline to Inner/Outer Layer Conductive Pattern (H = Board Thickness) H≤1.0mm ：0.3mm(20°V-CUT angle),0.33mm(30°),0.37mm(45°) H≤1.0mm ：0.3mm(20°V-CUT angle),0.33mm(30°),0.37mm(45°)
91 1.0 1.0
1.6 1.6
2.4 2.4
92 Minimum Inner Layer Isolation Width 7mil 9mil
93 Minimum Distance from Inner Layer Trace to Routing Edge (No Copper Exposure) 10mil 10mil
94 Minimum Spacing Between Hole Walls of Same Net 8mil (Through Holes, Laser Blind Vias); 10mil (Mechanical Blind/Buried Vias) 10mil (Through Holes, Laser Blind Vias); 12mil (Mechanical Blind/Buried Vias)
95 Minimum Spacing for ENIG Pads 3mil (Base Copper: 12μm, 18μm) 4mil (Base Copper: 12μm, 18μm)
96 Minimum Spacing Between Gold Fingers 5mil 6mil
97 Minimum Spacing for HASL Pads (Without Solder Mask) 8mil (10mil for pads isolated in large copper area) 9mil (10mil for pads isolated in large copper area)
98 Minimum Distance from Blue Mask to Pads 14mil 16mil
99 Minimum Distance from Legend/Silkscreen to Pads 6mil 6mil
100 Minimum Isolation Between Carbon Ink Areas 13mil 15mil
101 Metal Core Board (MCB MCB - Layer Count 1-8 layers (Aluminum base, Copper base) 1-8 layers (Aluminum base, Copper base)
102 Finished Board Size Range MAX: 610*610mm, MIN: 5*5mm (Aluminum base, Copper base) MAX: 610*610mm, MIN: 5*5mm (Aluminum base, Copper base)
103 Finished Board Thickness Range 0.5-5.0mm 0.5-5.0mm
104 Copper Thickness Range 0.5-2.0oz 0.5-2.0oz
105 Metal Base Thickness 0.5-5.0mm 0.5-5.0mm
106 Metal Base Material Aluminum: 1100/1050/2124/5052/6061; Copper: C11000 (Pure Copper); Pure Iron Aluminum: 1100/1050/2124/5052/6061; Copper: C11000 (Pure Copper); Pure Iron
107 Minimum Finished Hole Size & Tolerance NPTH: 0.5 ±0.05mm; PTH: 1.0 ±0.10mm (Aluminum base, Copper base) NPTH: 0.5 ±0.05mm; PTH: 1.0 ±0.10mm (Aluminum base, Copper base)
108 Metal Processing Dimensional Accuracy (Including Blind Cavity Depth Control Accuracy) ±0.05mm ±0.05mm
109 PCB Surface Finish Options Lead/Lead-free HASL; OSP; ENIG/ENEPIG; Electrolytic Soft/Hard Gold; Electrolytic Tin Lead/Lead-free HASL; OSP; ENIG/ENEPIG; Electrolytic Soft/Hard Gold; Electrolytic Tin
110 Metal Surface Treatment Copper/Electroless Nickel Gold; Aluminum: Anodizing/Hard Anodizing/Chemical Passivation; Mechanical Treatment: Sandblasting/Brushing Copper/Electroless Nickel Gold; Aluminum: Anodizing/Hard Anodizing/Chemical Passivation; Mechanical Treatment: Sandblasting/Brushing
111 Dielectric Material Bergquist (MP06503, HT04503); Taconic (TLY-5, TLY-5F) Bergquist (MP06503, HT04503); Taconic (TLY-5, TLY-5F)
112 Thermal Conductivity 0.3-12 W/m·K (Aluminum base, Copper base) 0.3-6 W/m·K (Aluminum base, Copper base)
113 Dielectric Layer (Thermal Adhesive) Thickness 75-150um 75-150um
114 Others Inner Layer Core Minimum Thickness 0.05 0.1
115 Layer Count 1-100 layers 1-40 layers
Flexible Area (Tab Structure) Max 8 layers Flexible Area (Tab Structure) Max 4 layers
Rigid Area (Including Flex Layers) Max 20 layers Rigid Area (Including Flex Layers) Max 8 layers
116
Board Thickness Range		 0.15-10.0mm 0.4-6.0mm
Flexible Area (Without Stiffener) Min 0.15mm Flexible Area (Without Stiffener) Min 0.15mm
Rigid Area (Without Flexible) 0.5-6.0mm Rigid Area (Without Flexible) 0.6-2.0mm
117 Minimum Finished Board Size 5*5mm 10*10mm
118 Maximum Finished Board Size 22.5"*48" (Both sides cannot exceed 22.5" simultaneously) ≤2 layers ：23"*35" ≥3 layers ：22.5"*30"
119 Layer-to-Layer Registration Accuracy ≤5mil ≤6mil
120 Board Thickness Tolerance Board thickness ≤1.0mm ：±0.1mm Board thickness ≤1.0mm ：±0.1mm
Board thickness >1.0mm ：±8% Board thickness >1.0mm ：± 10%
Special Thickness Tolerance ：T≤2.0mm,Tol= ±0.1mm;2.1 ≤T≤
3.0mm,Tol= ±0.15mm;3.1 ≤T≤7.0mm Tol= ±0.25mm(No specific layer structure requirements)		 Special Thickness Tolerance ：≤2.0mm,Tol= ±0.13mm ；2.1 ≤T≤3.0mmTol= ±0.15mm ；3.1 ≤T≤6.0mm， Tol= ±0.3mm（No specific layer structure requirements)
121 Impedance Tolerance Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) (Advanced capability: ±5% for ≥50Ω)
Differential: ±5Ω (≤50Ω), ±10% (>50Ω) (Advanced capability: ±5% for ≥70Ω)		 ±5Ω（ <50Ω ) , ± 10% (≧50Ω )
122 Outline Dimension Tolerance ±0.05mm ±0.1mm
123 Position Tolerance ±0.05mm ±0.1mm
124 Warp and Twist (Advanced Capability) 3‰ 7‰
125 Maximum Finished Copper Thickness (Inner/Outer Layers) Inner Layer: 12oz; Outer Layer: 28oz Inner Layer: 6oz; Outer Layer: 6oz
126 Minimum Dielectric Thickness 2mil (Only for HOZ base copper) 3mil (Only for HOZ base copper)
127 Minimum Legend Line Width and Height Line width 5mil, height 28mil (12μm, 18μm, 35μm base copper);
Line width 6mil, height 36mil (70μm base copper)		 Line width 5mil, height 28mil (12μm, 18μm, 35μm base copper);
Line width 6mil, height 36mil (70μm base copper)
128 Minimum Internal Corner Radius 0.4mm 0.6mm
129 V-CUT Angle Tolerance ±5° ±4mil
130 V-CUT Symmetry Tolerance ±4mil ±4mil
131 V-CUT Web Thickness Tolerance ±4mil ±4mil
132 V-CUT Board Thickness Range Base thickness (excluding outer copper) ≥0.4mm, Finished board thickness ≤4.0mm.
Base thickness ≤0.5mm: Single-side V-CUT only.
V-cut from both sides: 0.4mm ≤ Board thickness ≤4.0mm.
V-cut from single side: 0.4mm ≤ Board thickness <4.0mm.
Not available when board thickness <0.4mm or >3.2mm.		 Base thickness (excluding outer copper) ≥0.4mm, Finished board thickness ≤4.0mm.
Base thickness ≤0.5mm: Single-side V-CUT only.
V-cut from both sides: 0.4mm ≤ Board thickness ≤4.0mm.
V-cut from single side: 0.4mm ≤ Board thickness <4.0mm.
Not available when board thickness <0.4mm or >3.2mm.
133 Outline Methods CNC routing, V-CUT, breakaway tabs with mouse bites. CNC routing, V-CUT, breakaway tabs with mouse bites.
134 Minimum Solder Mask Dam Width (IC Pitch) 7mil (Green); 9mil (Other colors) 7mil (Green); 9mil (Other colors)
When base copper ≤1oz: 7mil (Green), 9mil (Other colors)
When base copper 2-4oz: 10mil		 2.5mil（允许局部1.5mil）
135 Minimum Solder Mask Overlap on Trace 2.5mil (Local 1.5mil allowed) 2.5mil (Local 1.5mil allowed)
136 Solder Mask Ink Colors Green, Yellow, Black, Blue, Red, White, Purple, Matte Green, Brown, Orange, Matte Black, Matte Blue, Transparent. Green, Yellow, Black, Blue, Red, White, Purple, Matte Green, Brown, Orange, Matte Black, Matte Blue, Transparent.
137 Legend Ink Colors White, Yellow, Black White, Yellow, Black
138 Gold Finger Bevel Angle Tolerance ±5° ±5°
139 Gold Finger Bevel Land Tolerance ±5mil ±5mil
140 Minimum Test Continuity Resistance 10Ω 10Ω
141 Maximum Test Insulation Resistance 100MΩ 100MΩ
142 Maximum Test Voltage 5000V DC / 3000 AC 5000V DC / 3000 AC
143 Maximum Test Current 200mA 200mA
144 Legend Marking Types (White Only) Serial Number, Barcode, QR Code Serial Number, Barcode, QR Code
145 Minimum Flexible Length 2mm 2mm
Minimum Hole-to-Rigid-Flex Border Distance ≥0.8mm ≥ 1mm

 

High-speed Transmission PCB

 

High-speed PCB - Overview

A high-speed PCB is a printed circuit board designed for high-speed digital signals, typically operating above 50 MHz, where the layout and routing significantly impact signal quality. These boards require special design considerations like impedance control, length matching, and maintaining signal integrity to prevent issues such as crosstalk, delays, and degradation.

 

Features of High-speed PCB

 

Nanosecond-Scale Signal Integrity

Impedance tolerance ≤±5% (e.g. 100Ω diff pair @95-105Ω), skew <5ps/cm

01

Ultra-Low Loss Transmission

 

Low-loss laminates (Df≤0.003, e.g. Rogers RO4835), loss <0.6dB/inch @10GHz

02

3D Electromagnetic Control

 

Back-drilled via stubs ≤0.2mm, microstrip/stripline phase matching ≤1°

03

Ultra-Quiet Power Delivery

 

PDN impedance ≤0.5mΩ (@1MHz), SSN suppression within ±2%

04

Precision Timing Management

 

Length matching ±5mil (0.127mm), intra-pair skew ≤0.15UI

05

 

Applications of High-speed PCB
 

Telecommunications

The main applications of high speed PCB boards in telecommunications are 5G networks and optical fiber networks, because both require efficient data transmission rates, which is precisely the advantage of high-speed PCB.

Computing and Data Centers

Data centers, such as supercomputers, servers and storage devices, require the ability of high speed circuit boards to quickly process and transmit large amounts of data.

Consumer Electronics

High-speed PCBs are also suitable for consumer devices such as smartphones, tablets and laptops, which all require high-speed data processing capabilities so that users can use these devices smoothly.

Automotive

High speed data transmission and real-time data processing required by automotive systems such as navigation systems and infotainment systems are undertaken by high speed printed circuit boards to cope with unexpected situations encountered during driving.

 

 

Certificate

 

productcate-1-1
productcate-1-1
productcate-1-1

 

 

Package & Delivery

 

Package: Standard export package or Custom
Delivery: By air express, by sea

productcate-1-1

 

 

FAQ

 

Q: What materials are used in high-speed PCBs?

A: Materials with heat resistance, mechanical toughness, and good (reliability)
Materials with stable Dk /Df parameters (small coefficient of variation with frequency and environment)
Materials with good impedance control
Materials with low roughness of the copper foil surface
Choosing glass fiber cloth with small flat openings is recommended.

Q: What types of components can be used on a high-speed PCB?

A: Usually, almost all types of components can be mounted on a high-speed PCB. There are no specified requirements for components that can be mounted on high-speed PCB. Which components to be mounted is determined by the customer's requirements and the characteristics of the electronic products.

Q: What is the difference between a high-speed PCB and a standard PCB?

A: For a standard PCB, people are mainly concerned about the short circuit, insulation, and other issues of the metal wire. However, with the pursuit of high performance of electronic products, the signal transmission frequency needs to be increased and people are more concerned about the signal integrity design of high-speed PCB.

Q: What is the maximum data transfer rate achievable on a high-speed PCB?

A: The theoretical maximum data transfer rate achievable on a high-speed PCB is 10.0GPs (Gigabits per second) by far, but this is improving continisouly.

Q: Are you manufacturer or trading company?

A: We are manufacturer.

Q: What's your best delivery time?

A: Within 15-30 days.

Q: What is the quality control of your product?

A: Follow strictly quality control measures for implementation,

Q: Will your company provide free sample?

A: It depends on which sort of item you want to get. Some can be provided free of charge, however, the client shall assume the shipping fees himself.

Q: Is OEM open to clients?

A: Yes, we can provide both OEM and ODM service.

Q: How can our company be your distribution partner?

A: We welcome you to be our distributor. For further details, please contact us.

Q: What is the payment of sample?

A: T/T and Alipay both acceptable.

Q: What is your packing?

A: Yes, our packaging is genuine original packaging. Of course, we can also provide neutral packaging or according to your requirements

Q: What is your sample policy?

A: If we have stock, we can provide samples, but the customer must pay the sample fee and express fee Question

Q: Have you tested all your goods before shipment?

A: Yes, we will conduct 100% test before delivery, and we will send detailed photos of parts for your approval Question .

Q: How can you maintain a long-term good relationship with our business?

A: We maintain good quality and competitive prices to ensure the interests of our customers.

As one of the most professional high-speed PCB manufacturers and suppliers in China, we're featured by quality products and low price. Please rest assured to buy cheap high-speed PCB from our factory.

DSC03026-03031, DSC03221-03225, Gold Finger PCB