Protruding Copper PCB

Protruding Copper PCB refers to a specialized circuit board featuring localized 3D copper structures (50-200μm above the conductor plane) created via selective plating or etching. Its core functions include:
1. 3D Interconnection: Acts as vertical conductive pillars for flip-chip packaging, replacing solder balls;
2. Thermal Management: Direct contact with heat-generating components reduces thermal resistance by 30%-50%;
3. High-Current Carrying: Local copper thickness reaches 400μm+ (vs. ≤70μm in standard PCBs), enabling 3-5x higher current capacity.
Key Process: Built using mSAP (Modified Semi-Additive Process) or pattern plating with photoresist masking.

Send Inquiry

Product Characteristics

1. 3D Copper Topology
50-200μm tall copper bumps/pillars (vs. ≤10μm flatness in standard PCBs) enable vertical interconnects and mechanical anchoring.

2. Localized Thick Copper
200-400μm copper thickness in critical areas (vs. ≤70μm), providing 3-5x higher current capacity.

3. Embedded Thermal Management
Direct chip-to-copper contact reduces thermal resistance by >40% (e.g. 30℃ IGBT junction temp drop).

4. Precision Placement
Photolithography achieves ±5μm alignment accuracy with minimum 80μm bump diameter.

5. Hybrid Material Integration
Compatible with copper-ceramic (AlN) and copper-resin composite substrates.

Product Application Field

Power Electronics

Tech Edge: 400μm local copper carries 200A+, bumps direct-attach to IGBT/SiC die (40% lower R<sub>th</sub>)

Use Cases: EV motor drives, solar inverters, industrial VFDs

Advanced Packaging

Tech Edge: 80μm Cu pillars enable ≤50μm-pitch 2.5D/3D IC interconnects (30% cost saving vs. TSV)
Use Cases: HBM interposers, Chiplet integration substrates

Automotive High-Voltage Systems

Tech Edge: Cu bumps provide mechanical anchoring for high-current joints (survive 20G vibration)
Use Cases: EV battery management units (BMU), ultra-fast charging ports

High-Frequency RF

Tech Edge: Cu bumps form λ/4 waveguides (≤1° phase error at 77GHz)
Use Cases: 5G mmWave feed networks, satellite T/R modules

Aerospace Power

Tech Edge: Cu-AlN composites withstand -55℃~200℃ thermal cycling (>500 cycles)
Use Cases: Satellite power converters, aircraft engine controllers

Hot Tags: protruding copper PCB, China protruding copper PCB manufacturers, suppliers, factory, DSC03097-03100, Halogen Free PCB, High speed RF PCB, High speed Transmission PCB, Multilayer High Speed PCB, Ultra thin Circuit Board