HDI Circuit Board

HDI PCB (High-Density Interconnect Printed Circuit Board) is a type of printed circuit board manufactured using advanced fine-line technology. Its defining characteristic is significantly higher wiring density compared to conventional PCBs, primarily achieved through:
1. Microvia Technology: Extensive use of small-diameter holes (typically ≤150μm, and often ≤100μm) created by laser drilling, forming micro-blind and buried vias.
2. Fine Line Width/Spacing: Features finer conductor trace widths and spacings (typically ≤100μm).
3. High-Density Routing & Interconnection: Enables more inter-layer connections and more complex routing within a smaller area.
4. Sequential Lamination/Build-up Process: Often manufactured using a sequential build-up process involving multiple laminations of core materials and dielectric layers.
Core Objective: To achieve higher electrical performance and signal integrity within a constrained space, meeting the demands of modern miniaturized, high-performance electronic devices (e.g., smartphones, tablets, laptops, wearables, high-end servers, networking equipment, medical devices).