Product Characteristics
1. High-Precision Electrical Connectivity
Provides stable chip-to-tester connection via micron-level probes/sockets, ensuring lossless signal transmission.
2. Signal Integrity Optimization
Utilizes impedance-controlled routing, shielding, and low-noise materials to minimize signal distortion and crosstalk.
3. Multi-Protocol Compatibility
Supports high-speed interfaces (e.g., PCIe, DDR, USB) and mixed-signal (analog/digital/RF) testing.
4. Thermal Management Capability
Integrates heatsinks/liquid cooling channels to stabilize chip temperature during testing (-55°C to +200°C).
5. Configurability & Modularity
Enables pin remapping and interchangeable load boards for various packages (BGA, QFN, CSP, etc.).
6. High Reliability & Durability
Withstands >1 million insertions; anti-wear materials guarantee longevity.
7. Automated Test Integration
Integrates seamlessly with ATE for high-speed parametric measurement and data analysis.
8. Application Versatility
Covers wafer probing (probe cards), final testing (load boards), and system-level testing (SLT boards).
9. Maximized Test Efficiency
Enables parallel testing of multiple chips, reducing production cycle time and marginal cost.
Product Application Field
Wafer-Level
Probe cards contact wafer pads at micron scale
01
Final Test
Load boards interface ATE with packaged chips
02
System-Level
OS-based stability validation
03
Reliability
Extreme environment stress testing: Temp cycling (-65°C~200°C), and Burn-in/ Humidity/ Vibration.
04
Vertical-Specific
Automotive: AEC-Q100 certification
RF/ HSIO: 5G/ PCIe signal integrity
Memory: Mass parallel testing
05
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