Delivery Capability
| Number of pins on a single board | 0- 1000 | Design delivery time (working days) | 3- 5 day |
| 2000 - 3000 | 5-7 day | ||
| 4000 - 5000 | 8- 12day | ||
| 6000 - 7000 | 12 - 15 day | ||
| 8000 - 9000 | 15 - 18 day | ||
| 10000 - 13000 | 18 - 20 day | ||
| 14000 - 1 5000 | 20 - 22 day | ||
| 16000 - 20000 | 22 - 30 day | ||
| Extreme delivery capability | 10000 Pin/ 6 day |
Design Capabilities
Tontek boasts years of professional PCB design experience, a robust design process, and comprehensive technical support. We are at the forefront of PCB design, with in-depth research and expertise in high-speed substrates and processes.
Design types include high-frequency, microwave, high-speed, mixed-analog, high-density, high-voltage, high-power, RF, backplanes, ATE, flex, and rigid-flex boards. Our comprehensive DFX simulation system addresses production concerns early in the design process, meeting customer requirements across a wide range of areas, including design, schedule, cost, materials, production processes and their limitations, reliability, and safety.
We support mainstream design software, including but not limited to Allegro, Pads, Altium, and Mentor. Schematic software includes CIS/ORCAD, Concept-HDL, Protel DXP, Mentor DxDesigner, and Design Capture.
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Maximum signal design rate |
224G - PAM4 |
Maximum design pin count |
150000 PIN |
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Maximum number of design layers |
68 floors |
Maximum BGA pin count |
8371 |
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Maximum number of BGAs |
120 |
Minimum BGA design pitch |
0.3 mm |
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Minimum mechanical drilling |
6 mil |
Minimum laser drilling |
4 mil |
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FPC design |
20-layer rigid-flexible board |
HDI design |
Blind buried vias, vias in pads, buried capacitance, buried resistance |
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Minimum line width/line spacing |
2 mil / 2 mil(HDI) |
Design Domains
Involved Fields
IT Communication
Switches, routers, optical modules, self-developed 4G/5G high-end terminal equipment, trunk and access network transmission equipment, optical networks, network storage equipment, massive storage, etc.
Medical Devices
Ultrasound equipment, magnetic resonance equipment, digital X-ray imaging, in vitro diagnosis (IVD), CT, infrared temperature measurement and blood detection, particle analyzers, dry chemical analyzers, chemical luminescence detectors, analyzers, monitors and other equipment.
Computer
Cloud computing, big data, servers, AI computing power cards, notebooks, tablet computers, network storage and other equipment.
Industrial Control
Artificial intelligence, robots, machine vision, intelligent manufacturing equipment, environmental monitoring, smart grids, power distribution networks, clean energy equipment, engineering machinery, agricultural machinery, fire protection equipment and other industrial automation equipment.
Semiconductor
Integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other chips.
New Energy Vehicles
Intelligent driving systems, ADAS sensors, high-performance computing units, motor control units, inverters, battery packs, digital communication gateways, power converters, millimeter-wave radars, 360-degree panoramic cameras, sensors, in-vehicle entertainment systems, etc.
Multimedia
Security and monitoring equipment, wearable devices, interactive teaching all-in-ones, smart conference systems, LCD TVs, displays, smart phones, digital cameras, Bluetooth speakers, projectors, GPS, VR, smart logistics, etc.
Rail Transit
Rail transit vehicles and various electromechanical equipment, rail transit autonomous operation systems, train dispatching command systems, testing equipment, equipment monitoring systems, traction drive systems, braking systems, etc.
Design Process
Customers are required to provide: schematics, netlists, structure diagrams, device data for the newly created library, design requirements, etc.
- Tongtai Electronics layout and routing review: This review will be conducted in accordance with Tongtai Electronics' design specifications, design guidelines, customer design requirements, and relevant checklists.
- Customer layout confirmation: Tongtai Electronics will provide layout and structure files for the customer to review. The customer will confirm the layout rationality, stackup scheme, impedance scheme, structure, and packaging, and confirm routing parameters.
- Design data output: PCB source files, Gerber files, assembly files, stencil files, structure files, etc.
Solutions
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Processor |
HiSilicon: Hi31/Hi35/Hi37 series |
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Rockchip: Rk33/32/31/30/35/18 series |
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Loongson: Loongson 1/Loongson 2/Loongson 3 series |
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Sunway: 3232/3231/1621/1631/421 |
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Feitian: FT-2500/FT-2000/FT-1500 series |
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Cambricon: C10 |
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AMD：Fp3/Fp5 |
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Intel：Purley Ivy Bridge and Sandy Bridge Series Whitley Eagle Stream Shark Bay Mobile Platform Grantley lake Coffeelake-H Ice Lake Comet Lake Tiger Lake E810 Cooper Lake |
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Marvell：PXA920/920H Series/3XX/27X Xelerated Series ARMADA1000/1500 98CX8129/8297 |
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Qualcomm/SPRD/MTK Mobile：MSM86XX / 82XX / 76XX SC9610 / 8810 / 6820 MT6573 / 6575 / 6577/ 6589 |
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Freescale PowerPC Series：MPC8541 / 8548 / 8555 / 8641 P2020 |
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TI：AM35X / 38X / 335X / 437X / 5K2EX / P3505 OMAP4430 66AK2EX / AK2HX C667X |
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ADI：ADSP-21XXX ADUCM70XX/71XX |
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FPGA/CPLD |
Xilinx：Spartan-6 Spartan -7 FPGA Artix-7 Kintex-7 Virtex-7 Virtex5 Zynq-7 Virtex-ultrascale XCVU7P/XCVU9P/XCVU11P/XCVU13P/XCVU15P/XCVU19P |
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Intel/Altera：Stratix Series ( S10) Arria Series ( A10 ) Cyclone series MAX Series 1SG280 Nf43 |
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Cavium：CN9XXX CN8XXX CN7XXX CN6XXX NITROX III NITROX PX CN50XX |
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Lattice：MachX03 Series MachX02 Series LatticeECP3 Series iCE40 Series |
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| Power modules and chips |
TI：TPS62XXX/65XXX TPS75XXX/82XXX TPS54XXX/40XXX LM51XXX/50XXX PTH0XXX BQ25XXX/24XXX |
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Renesas：ISL91302B ISL91301A ISL91301B ISL99140 ISL99227 |
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MPS：MPM26XX/35XX MPM36XX/38XX MPM54XX MEZD41XXX |
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Intel：EM2140P01QI |
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Linear：LTM46XX/80XX |
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Maxim：MAX8698/8903A |
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| Conversion interface chip |
Broadcom：BCM56334/56331/56960/56980/56990 BCM84793/8129/88370/88470…… NLA122048 |
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ADI：AD5767/4001/9776/9779 AD9788/8370/8012 ADE9000 ADAQ7980/7988 |
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TI：ADS8860/8861/54J60 ADC32RF45/3244/8775 ADC39J84/80004 DAC5681DAC3282 |
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Marvell：88E6083/1111/8070/8059 88DE2750 |
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PMC：PM5440/5990/80XX |
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ClariPhy：Cl20010 |
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| Memory chips |
Samsung：DDR2 DDR3 DDR4 DDR5 GDDR5/GDDR5x/GDDR6 |
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Hynix：DDR2 DDR3 DDR4 DDR5 GDDR5/GDDR5x/GDDR6 HBM/HBM2/HBM2e |
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Elpida：DDR2 DDR3 |
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Mircon：DDR2 DDR3 DDR4 DDR5 GDDR5/GDDR5x/GDDR6 |
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Cypress：CY7C1510 CY7C1565 CY7C25XX |