Multilayer Rigid-Flex Printed Circuit Board

A hybrid printed circuit board that integrates rigid substrates (for mechanical support and component mounting) and flexible polyimide layers (for bending or dynamic flexing) into a single structure through lamination. It enables multilayer interconnections across rigid and flexible sections, allowing three-dimensional routing and space-saving designs. Key features include:
1. Multilayer Construction: Contains two or more conductive layers;
2. Rigid-Flex Integration: Combines rigid sections (e.g., FR-4) for mechanical support with flexible sections (e.g., polyimide film) for bendability or 3D assembly;
3. Unified Interconnection: Electrical continuity between rigid and flexible areas is achieved via plated through-holes (vias) or bonding processes.
Primary Applications: Electronics requiring both structural stability and dynamic flexing (e.g., foldable smartphones, aerospace systems, medical devices).

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Product Characteristics

1. 3D Integration Capability
Enables 3D routing topology, replacing traditional multi-PCB+cable assemblies.

2. Dynamic Bendability (Flex Zones)
Flex sections withstand >1 million bend cycles (per IEC 60335), min. bend radius: 0.5mm.

3. Mechanical Rigidity (Rigid Zones)
Rigid substrates (e.g., FR-4) provide component mounting with shock resistance >1000G.

4. High-Density Interconnection
Achieves 20+ layer interconnects via laser μVias, line width/spacing ≤40μm.

5. Lightweight & Thin Profile
60% thinner and 50% lighter than conventional "PCB + wiring harness" solutions.

6. Environmental Robustness
Operating range: -55℃ to +125℃ (MIL-P-50884 compliant), chemical corrosion resistant.

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Product Application Field

Consumer Electronics

Foldable Devices: Hinge circuitry (e.g., Samsung Galaxy Fold)
Wearables: Curved display drivers in smartwatches, TWS earphone charging case interconnects

Aerospace & Defense

Satellite Deployables: Solar array folding circuits (survives -120℃~+150℃ thermal cycling)
Avionics: Radar beam steering modules (40% weight reduction, 100G vibration resistant)

Medical Devices

Endoscopes: Articulating shaft wiring for 360° rotation (＞50k bend cycles)
Implantables: Multilayer rigid-flex in pacemakers (＜0.3mm thick, biocompatible)

Automotive Electronics

ADAS: Integrated mmWave radar FPC + rigid control board (±5% impedance control)
BMS: High-voltage sampling circuits in EV battery packs (2000V isolation voltage)

Industrial Systems

Robotic Arms: Multi-axis motion control signal transmission (replaces 20 cables, ↓90% failure rate)
Precision Sensors: Wafer inspection probe cards (10μm line width, ±1μm alignment)

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