Multilayer Flexible Rigid-Flex PCB

A Multilayer Flexible Rigid-Flex PCB is a hybrid printed circuit board that integrates multilayer rigid substrates (typically ≥4 layers) with multilayer flexible circuits (≥2 layers) into a unified 3D-interconnected module. Key characteristics include:
1. Unified Rigid-Flex Construction: Rigid zones serve as mechanical supports and component-mounting platforms, while flex zones enable dynamic bending or static 3D routing;
2. High-Density Lamination: Flexible sections use stacked polyimide (PI) layers (e.g., 4-12 layers) with microvias for interlayer conduction;
3. Seamless Transition: Copper layers extend continuously across rigid-flex junctions via lamination bonding, eliminating connectors and preserving signal integrity;
4. 3D Topology: Configurable into folded, curved, or stacked geometries, transcending planar layout limitations of conventional PCBs.
Designed for space-constrained, high-speed applications such as spacecraft payloads, medical endoscopes, and 5G mmWave modules.

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Product Characteristics

1. Structure Design
Integrated Lamination: Rigid zones (4-20L FR4/ceramic) + Flex zones (2-24L PI films) co-bonded
Ultra-Thin Flex Stack: ≤25μm per dielectric layer, total flex thickness <0.4mm (with copper)

2. Electrical performance
HF Low-Loss: Insertion loss <0.2dB/cm@10GHz (with MPI)
Controlled Impedance: ±5% tolerance at junctions (laser-trimmed)
HDI Capability: 35μm line/space, 60μm microvias in flex zones

3. Mechanical properties
Dynamic Flex Endurance: >500K cycles @0.5mm bend radius (IPC-6013D Class 3)
3D Conformability: Supports permanent forming (≥1mm radius) or dynamic folding
Stress Resistance: Matched CTE (14ppm/℃ rigid vs 18ppm/℃ flex)

4. Thermal management
Hybrid Thermal Path: Embedded copper in rigid (>400W/mK) + thermal adhesive in flex (>3W/mK)
Temp Resilience: -269℃~+260℃ (cryogenic to reflow)

5. Reliability
Hermetic Sealing: <1×10⁻⁹ Pa·m³/s leak rate at junctions (space-grade)
Chemical Resistance: Passes 96hr salt spray (ASTM B117) & solvent immersion

Multilayer Flex Rigid-Flex PCB

Product Application Field

Aerospace

Deployable antenna arrays (e.g., phased array radar)
Foldable power panels for deep-space probes
Spacesuit vital-sign monitoring

Medical

Intravascular ultrasound probes (128+ channels)
Brain-machine interface electrode arrays
Surgical robot multi-joint control

Telecom

mmWave antenna feed networks (24-77GHz)
Reconfigurable intelligent surfaces (RIS)
Photonic IC optical interposers

Quantum Computing

Superconducting qubit interconnects
Cryogenic signal interposers (4K)
Quantum sensor packaging

Industrial

Wafer test probe cards
Multi-axis motion control in robotics
3D circuits in micro-surgical tools

Consumer

Multilayer hinge circuits in foldable phones
Curved optical engines in AR glasses
Holographic projection drivers

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