Book-Type Structure Rigid-Flex PCB

A Book-Type Structure Rigid-Flex PCB is a specialized type of printed circuit board (PCB) that integrates conventional rigid PCB sections with bendable flexible circuit sections, assembled into a compact three-dimensional module using a specific folding or stacking method resembling the opening and closing of a book. This design utilizes flexible circuitry in areas requiring connection between different planes or dynamic bending, while employing rigid substrates to support components and provide structural rigidity where needed. Once assembled, the entire module can be "opened" like a book for maintenance or testing access, and "closed" to form a space-saving, highly reliable interconnection unit. It is commonly used in electronic devices where space is constrained, and high-density interconnections and reliability are critical.

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Product Characteristics

1. Structure Design
Multiple rigid sub-boards interconnected by flex circuits, foldable/unfoldable along designed axes;
Space-saving in folded state (like closed book), service-friendly in expanded state (like open book)

2. Material integration
Rigid zones: FR4/high-frequency substrates for component support and rigidity
Flex zones: Polyimide (PI) films for dynamic bending and interplanar routing
No connectors at junctions; seamless transition via lamination

3. Space Efficiency
Flex circuits replace bulky cables, saving >90% wiring space
Folded profile reduces thickness to 30-50% vs. stacked PCBs

4. Electrical performance
Controlled impedance continuity (±5%) at rigid-flex junctions
Microstrip/stripline designs in flex zones minimize crosstalk (< -40dB)
Connectorless interface enables >10Gbps high-speed transmission

5. Reliable and long-lasting
Flex zones rated for >100,000 fold cycles (IPC-6013D compliant)
Fatigue-resistant design at rigid-flex interfaces
Operating temp: -55°C ~ +125°C (military-grade)

6. Functionally scalable
Sub-board level modularization (e.g., RF/power/digital zones)
Foldable structure enables EMI shielding compartmentalization

7. Maintain cost advantage
Full circuit access in unfolded state without disassembly
Individual sub-board replacement reduces repair cost

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Product Application Field

Aerospace

Deployable antenna/solar panel circuits in satellites
Avionics systems (e.g., foldable radar arrays)
3D wiring in spacecraft cabins

Medical

Wearable/implantable monitors (e.g., pacemakers)
Endoscope/surgical robot joint control circuits
Foldable mainboards in portable diagnostic devices

Consumer Electronics

Hinge interconnect modules in foldable phones
Flip-screen circuits in ultra-thin laptops
Adjustable wiring in VR/AR headsets

Industrial

Multi-axis joint control in industrial robots
Foldable probe circuits in automated testers
Stacked sensor packaging

Automotive

Retractable radar arrays (e.g., mmWave radar)
Adjustable circuits for seats/mirrors
High-density BMS modules

Defense

Foldable terminals in soldier systems
Foldable fuze circuits in missile guidance
Vibration-resistant comms in field equipment

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