Halogen-Free PCB

A Halogen-Free PCB is an eco-friendly printed circuit board that excludes chlorine (Cl), bromine (Br), and other halogen elements, defined by:
1. Material Composition:
Halogen content: Cl ≤ 900 ppm, Br ≤ 900 ppm, total halogens ≤ 1500 ppm (per IEC 61249-2-21)
Flame retardants: Uses phosphorus-nitrogen systems or metal hydroxides (e.g., Al(OH)₃) instead of halogenated compounds
2. Certifications:
Complies with RoHS 2.0, IEC 61249-2-21, JPCA-ES-01-2003
3. Key Properties:
Thermal stability: Decomposition temperature ≥ 320℃ (vs. 310℃ for standard FR-4)
Low smoke/ toxicity: Reduces smoke density by 40% and nearly eliminates toxic gas (e.g., dioxins) during combustion
Applications: Consumer electronics (smartphones/laptops), medical devices, EV battery management systems (BMS) requiring high environmental safety

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Product Characteristics

Eco-Safety Properties

Hazard Control:
- Halogens: Cl ≤ 900 ppm, Br ≤ 900 ppm, total halogens ≤ 1500 ppm (IEC 61249-2-21)
- Eliminates halogenated flame retardants (e.g., TBBPA)
Fire Safety:
- Low smoke density (toxicity index <5 vs. >30 for FR-4)
- Near-zero release of dioxins/hydrobromic acid during combustion

Electrical & Thermal Performance

Dielectric Properties:
- Lower Dk (3.8~4.2 @1 GHz, 0.3~0.5 lower than FR-4)
- Dissipation factor (Df 0.010~0.018), enhancing high-frequency signal integrity
Thermal Stability:
- Glass transition temperature (Tg ≥170℃), decomposition temp. ≥320℃ (10~15℃ higher than FR-4)
- Z-axis CTE (≤3.5%), reducing delamination risks

Mechanical & Reliability

Copper Adhesion:
- Peel strength ≥0.8 N/mm (ensured by low-profile copper foils)
CAF Resistance:
- Conductive anodic filament lifetime >1000 hours (85℃/85% RH, reinforced by silica fillers)
Moisture Resistance:
- Water absorption <0.1% (vs. 0.15% for FR-4), stable insulation resistance at high humidity

Manufacturing Adaptability

Process Challenges:
- Poor resin flow requires 10~15% higher lamination pressure and extended curing time
- Drilling-induced resin smear (optimized drill speed/feed rate needed)
Surface Finish Compatibility:
- Supports EnIg, OSP, Immersion Tin, but immersion silver (Imm-Ag) may corrode due to halogen migration

Product Application Field

Consumer Electronics

Smart Devices:
- Smartphone motherboards (Apple/Samsung mandate total halogens ≤1000 ppm)
- Laptop power modules (comply with IEC 62368 fire safety)
Value:
- Reduced combustion toxicity enhances user safety
- Low Dk (3.8~4.2) improves 5G mmWave antenna performance

New Energy Vehicles

E-Powertrain Systems:
- BMS boards (flame rating UL 94 V-0)
- OBC modules (operational temp 125℃ vs. 105℃for FR-4)
Safety Edge:
- Zero dioxin emission during collisions
- Complies with ISO 26262 ASIL-D functional safety

Medical Equipment

Implantable Devices:
- Pacemaker PCBs (prevents halogen ion leakage)
- Neurostimulators (pass ISO 10993 biocompatibility)
Imaging Systems:
- MRI gradient control boards (low Df ≤0.015 ensures signal fidelity)

Industrial & Energy

Automation:
- PLC controllers (high Tg≥170℃, lifespan >15 years)
- Robot servo drives (CAF resistance >1000h @85% RH)
Energy Infrastructure:
- Solar inverters (outdoor durability,

- 40℃~125℃ cycling 2000 cycles)
- EV charger modules (flame rating GWIT 850℃)

Data Center & Telecom

Servers/Switches:
- High-speed backplanes (112G PAM4, low Dk cuts signal loss 20%)
- Meet IEEE 802.3ck Ethernet standard
5G Base Stations:
- AAU RF boards (comply with GR-63-CORE vibration/shock)

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