(1) It is best to place the components on one side. If double-sided placement of components is required, pin type components should be placed on the bottom layer, and it is best to place components on one side. It is possible that the circuit board may be difficult to place and not conducive to soldering, so it is best to only place surface mount components at the bottom layer, similar to the common method of arranging components on computer graphics card PCB boards. When placed on one side, only a silk screen layer needs to be applied on one side of the circuit board to reduce costs.
(2) Reasonably arrange the position and direction of interface components. Generally speaking, as a connection between a circuit board and the outside world (power supply, signal lines), as a connector component between the circuit board and the outside world (power supply, signal lines), it is usually arranged at the edge of the circuit board, such as serial and parallel ports. If placed in the center of the circuit board, it is obviously not conducive to wiring. Connector components are usually arranged at the edges of the circuit board, such as serial and parallel ports. It is also possible that the connection cannot be made due to obstacles from other components. In addition, when placing the interface, pay attention to the direction of the interface so that the connecting wires can be connected. When placing the interface, pay attention to the direction of the interface and ensure that it is smoothly led out and away from the circuit board. Smoothly lead out and keep away from the circuit board. After the interface is placed, the type of interface should be clearly indicated using the String of the interface component; For power interfaces, the voltage level should be indicated to prevent circuit board burnout caused by wiring errors. For power interfaces, the voltage level should be indicated to prevent circuit board burnout caused by wiring errors.
(3) It is best to have a wide electrical isolation tape between high-voltage components and low-voltage components. That is to say, it is best to have a wide electrical isolation tape between high-voltage components and low-voltage components, so as not to have a significant difference in voltage levels. Do not place components with significantly different voltage levels together. Placing components together is beneficial for electrical insulation, signal isolation, and anti-interference
(4) It is best to place components with close electrical connections together. This is the modular layout concept. )It is best to place components with close electrical connections together. This is the modular layout concept.
(5) For components that are prone to noise, such as clock generators and high-frequency devices such as crystal oscillators, they should be placed as much as possible. For components that are prone to noise, such as clock generators and high-frequency devices such as crystal oscillators, their clock input terminals should be placed. High current circuits and switch circuits are also prone to noise and are placed near the clock input of the CPU. High current circuits and switch circuits are also prone to noise, so these components or modules should be placed away from high-speed signal circuits such as logic control circuits and storage circuits, or modules should be placed away from high-speed signal circuits such as logic control circuits and storage circuits. If possible, it is recommended to use a control board combined with a power board to connect through interfaces, in order to improve the overall anti-interference ability and operational reliability of the circuit board.
(6) Try to place decoupling capacitors and filtering capacitors around the power supply and chip. The arrangement of decoupling capacitors and filtering capacitors is to improve the circuit board's electrical performance. Decoupling capacitors and filtering capacitors should be placed around the power supply and chip as much as possible. Source quality is an important measure to improve anti-interference ability. In practical applications, the routing, pin connections, and wiring of printed circuit boards may cause significant parasitic inductance, resulting in high-frequency ripples and spikes in power and signal waveforms. Placing them between the power supply and ground may also cause significant parasitic inductance, leading to high-frequency ripples and spikes in power and signal waveforms. A 0.1 F decoupling capacitor can effectively filter out these high-frequency ripples and spikes. If a chip capacitor is used on the circuit board, it should be placed close to the power pin of the component. Place the surface mount capacitor close to the power pin of the component. For power conversion chips or power input terminals, it is best to install a 10 F or larger capacitor to further improve power quality.
(7) The numbering of components should be arranged close to the frame of the components, with uniform size, neat direction, and not overlapping with the components, vias, and solder pads. The numbering of components should be arranged close to the frame of the components, with uniform size, neat direction, and stacking. The first pin of the component or connector indicates the direction; The positive and negative signs should be clearly marked on the PCB and not allowed to be covered; Power conversion components (such as converters, linear conversion power supplies, and switching power supplies) should have sufficient heat dissipation and installation space next to them, as well as sufficient soldering space on the periphery. Leave sufficient welding space on the periphery, etc.