Product Characteristics
1. Ultra-Loss Substrates
High-frequency laminates (e.g., Rogers RO4000, PTFE) with stable Dk (±0.05) and ultra-low loss tangent (tanδ ≤0.002).
2. Tight Impedance Control
50Ω impedance tolerance ±5%, using CPW/stripline to suppress skin effect at GHz bands.
3. Thermal-Stable Dk
Matched CTE between substrate and copper, Dk variation <1% from -40℃ to 150℃.
4. Precision Etching
Line width tolerance ±0.02mm, edge roughness <3μm for minimal loss in mmWave bands.
5. 3D EM-Optimized Design
HFSS-simulated radiation patches/slot couplings to enhance gain/directivity.
6. Hybrid Stackup
HF layers + FR4 core hybrid stackup for cost-effective >10-layer HDI integration.
Product Application Field
5G/6G mmWave Communications
Band: 24/28/39GHz (FR2)
Use Case: AAU, Small Cell Massive MIMO Arrays
Requirements:
- 64+ element phased array integration
- Beam steering accuracy ±0.5°
- Dk tolerance ±0.02
01
Autonomous Driving Sensors
Band: 77/79GHz (Automotive Radar)
Use Case: Front/Angle/4D Imaging Radar
Requirements:
- 4GHz UWB signal handling
- Gain variation <1dB (-40℃~125℃)
- AEC-Q200 certified substrates
02
LEO Satellite Networks
Band: Ka-band (26-40GHz)
Use Case: Satellite Phased Arrays/Ground Terminals
Requirements:
- PIM < -150dBc
- Micro-discharge prevention in vacuum
- Power handling >100W/channel
03
Medical Imaging Systems
Band: 122GHz (Terahertz Imaging)
Use Case: Early Cancer Detection/Drug Inspection
Requirements:
- Sub-mm radiator precision (±5μm)
- Biocompatible packaging (ISO 10993)
- SNR >80dB
04
Military EW Systems
Band: Ku-band (12-18GHz)
Use Case: ECM Jammers/Radar Seekers
Requirements:
- Instantaneous bandwidth ≥2GHz
- EMP shielding 100kV/m
- MIL-PRF-31032 compliance
05
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