Buried Copper Block PCB

An Buried Copper Block PCB is an advanced printed circuit board that integrates solid metal copper blocks (pure Cu or alloy) into specific internal areas during lamination, achieved through mechanical milling + thermal compression. It eliminates thermal bottlenecks for ultra-high-power devices by creating near-zero thermal resistance paths.
Core Characteristics:
1. Embedded Structure
- Cu coin thickness: 0.5mm~5mm, area >120% of heat source
- Position: Directly under power devices (e.g., CPU/IGBT)
2. Thermal Performance
- Thermal conductivity: ≥380W/mK (pure Cu, 1000× FR-4)
- Thermal resistance: <0.1°C/W (die-to-heatsink)
3. Mechanical Interlock
- Serrated/micro-drilled sidewalls (↑300% adhesion area)
- Dielectric fill: High-thermal-conductivity prepreg (e.g., Bergquist HT-04503)

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Product Characteristics

Revolutionary Thermal Performance

- Extreme Conductivity: ≥380W/mK thermal conductivity (1000× FR-4)
- Near-zero Thermal Resistance: Die-to-heatsink θ＜0.1°C/W
- Heat Flux Capacity: ＞500W/cm² local power handling

Precision Structural Engineering

- Mechanical Interlock: Serrated/micro-drilled sidewalls (bonding strength＞50MPa)
- CTE Stress Management: Buffer layer absorbs ΔCTE≥15ppm/℃
- Topology Optimization: Biomimetic copper branches (↑200% cooling area)

Electrical Assurance

- Signal Integrity: Ground shielding around coins (crosstalk rejection＞30dB @10GHz)
- Power Integrity: Direct connection to PWR plane (impedance＜0.5mΩ)
- High-Voltage Isolation: Dielectric withstand＞5kV

Extreme Environment Reliability

- Passes 3000x thermal cycles (-40°C~150°C)
- Vibration resistant: 100G acceleration (MIL-STD-883)
- 1000hrs damp heat (85°C/85% RH) with no corrosion

Product Application Field

1. High-Power Electronics
Inverters, UPS systems, and converters requiring rapid heat dissipation.

2. Automotive Electronics
EV motor controllers, onboard chargers (OBCs), ensuring stability in high-temperature environments.

3. Industrial Equipment
Motor drives, power modules, preventing overheating failures.

4. Aerospace & Defense
Radar systems, avionics power supplies, demanding extreme reliability and thermal control.

5. 5G/Telecom Base Stations
Power amplifiers (PAs), RF modules for high-frequency/high-current operation.

6. High-Power LED Lighting
Automotive headlights, industrial lighting, reducing thermal degradation.

7. Server/Data Center PSUs
Power supply units (PSUs) for efficient energy conversion.

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