Flexible High Frequency PCB

Flexible High-Frequency PCBs utilize specialized polymer substrates (e.g., LCP/modified PI) with precision microstrip lines to transmit high-frequency signals (up to 110GHz) under bending conditions. Key advantages:
1. 3D Conformability – Adapts to curved surfaces (e.g., radomes, wearables)
2. Dynamic Flex Endurance – >100,000 bend cycles (radius R<1mm)
3. mmWave Loss Control – Insertion loss <0.5dB/cm @60GHz
Critical for foldable device antennas, automotive radar sensors, implantable medical electronics.
Flexible HF PCBs bridge dynamic flexibility and mmWave performance, enabling next-gen wearables, automotive sensors, and bio-electronics. They will push boundaries into the THz spectrum (0.1-0.3THz) for 6G communications.
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Description

Product Characteristics

 

 

1. Material Properties
1.1 Ultra-low loss: LCP Df=0.002@10GHz (5x lower than standard PI)
1.2 Stable Dk: Thermal drift <30ppm/℃, Dk variation <±2% after bending


2. High-Frequency Integrity
2.1 Bending performance: Insertion loss rise <15%@40GHz at R=3mm
2.2 Impedance control: ±5% tolerance during flexing (vs. >±20% in standard FPC)


3. Mechanical Reliability
3.1 Flex endurance: 200k cycles for 0.5mm LCP (R=1mm)
3.2 Environmental resistance: -40℃~150℃ operation, 85℃/85%RH 1000h


4. Integration Advantages
4.1 Rigid-flex integration: Combines HF flex zones with FR4 rigid sections
4.2 Ultra-thin profile: ≤50μm thickness for intravascular devices

 

Product Application Field

 

 

Flexible High-Frequency PCBs enable critical applications via ultra-thin bendable structure, stable mmWave performance, and environmental resilience:

 

Consumer Electronics

Foldable phone: mmWave antennas (LCP substrate, ΔIL<10%@28GHz after 100k bends)
AR/VR: eye-tracking radar (60GHz flex patch, R=3mm curvature)

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Automotive Electronics

Curved bumper: 77GHz radar sensors (Modified PI, matches R150mm body contour)
Battery: temperature monitoring belts (LCP flex arrays, >150℃ rating)

02

 

Medical Devices

Intravascular: ultrasound catheters (25μm LCP circuits, >40MHz bandwidth)
Wearable: vital sign monitors (40GHz flex radar, HR error<1%)

03

 

Aerospace & Defense

Conformal wing: SAR radar arrays (Ka-band modified PI, 0.1m resolution)
Satellite: deployable antennas (LCP film thickness<3mm, deployed area>5m²)

04

 

Industrial IoT

Rotating machinery: wireless monitoring (60GHz flex transceiver, >500k bend cycles)
Robotic: joint sensing (Flex waveguide strain detection, ±0.01° accuracy)

05

 

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