Product Characteristics
1. Structural Advantages
1.1 Depth-controlled cavities: Machining/laser precision ±25μm for bare die embedding.
1.2 Metallized cavity walls: Electroless+electroplated copper for sidewall interconnects (impedance tolerance ±5%).
2. Electrical Performance
2.1 Reduced parasitics: Interconnect inductance as low as 0.1nH (vs. 1-2nH in SMT).
2.2 mmWave enhancement: 15% lower insertion loss @40GHz by eliminating solder discontinuities.
3. Thermal Management
3.1 Direct-attach cooling: Power devices bonded to metal cores (Al/Cu), >40% lower thermal resistance.
3.2 Embedded microchannels: Coolant channels in cavities handle >300W/cm² power density.
4. Reliability & Density
4.1 Mechanical robustness: Embedded design passes MIL-STD-810H vibration tests.
4.2 Component density doubled: Cavity + SMT enables dual-side assembly.
Product Application Field
Cavity PCBs enable embedded component integration via precision-machined recesses, critical for:
mmWave RF Systems
5G/6G: AiP Modules: RF ICs in cavities shorten antenna feeds to 0.3mm
Satellite: T/R Modules: GaN dies bonded to ceramic cavities, θja＜1℃/W
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High-Power Electronics
EV: Inverters: SiC modules in copper cavities reduce junction temp by 30℃
Laser: Diode Arrays: Microchannel-cooled cavities handle 500W/cm²
02
Aerospace Electronics
Radar: Seekers: GaAs MMICs in LTCC cavities cut weight by 50%
Space-Grade: Computing: FPGA+capacitors in deep cavities tolerate ＞100krad
03
Medical Micro-Devices
Endoscope: Image Sensors: CMOS in shallow cavities, thickness≤1.2mm
Implantable: Neuro-Stimulators: MCU hermetically sealed in biocompatible cavities
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Quantum Computing
Superconducting: Qubit Interconnects: Cavities shield EMI at 4K operation
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