(1) Optimize circuit design: During the design phase, factors such as current distribution, line width, line spacing, and aperture should be fully considered to avoid local overheating caused by improper design. In addition, increasing the width and spacing of wires appropriately can reduce current density and minimize heat generation.
(2) Choose high-quality boards: When purchasing PCB boards, reliable suppliers should be selected to ensure that the board quality meets the requirements. At the same time, strict incoming inspection should be carried out to prevent copper blistering caused by quality issues with the sheet metal.
(3) Strengthen production management: Establish strict process flow and operating standards to ensure quality control at all stages of the production process. In the pressing process, it is necessary to ensure that the copper foil is fully pressed against the substrate to prevent air from remaining between the copper foil and the substrate. During the electroplating process, 1. Control the temperature well to avoid excessively high temperatures. 2. Ensure uniform current density, design electrode shape and layout reasonably, and adjust the flow direction of electrolyte. 3. Use high-purity electrolyte to reduce the content of pollutants and impurities. 4. Ensure that the ratio and area of the anode and cathode are appropriate to achieve uniform current density. 5. Perform good substrate surface treatment to ensure surface cleanliness and thorough activation. In addition, good humidity and ventilation conditions should be maintained in the production environment.