One of the key factors in designing high-speed power PCB boards for PCB power layer wiring is to minimize the voltage drop caused by line impedance and the various noises introduced by high-frequency electromagnetic field conversion as much as possible. There are usually two methods to solve the above problems. One is power bus technology, and the other is the use of a separate power layer for power supply.
1. There should be a clear layout distinction between AC input and DC output, and the best way is to isolate them from each other.
2. The wiring distance between the input and output terminals (including the primary and secondary DC/DC converters) should be at least 5 millimeters.
3. There should be a clear layout distinction between the control circuit and the main power circuit.
4. Try to avoid parallel wiring of high current and high voltage wiring with measurement and control lines.
5. Lay copper as much as possible on the blank board surface.
6. In high current and high voltage wiring connections, try to avoid using wires for long-distance connections in space, as the interference caused by it is difficult to handle.
7. If the cost allows, multi-layer board wiring can be used, with dedicated auxiliary power and ground layers, which will greatly reduce the impact of EMC.
8. The workplace is the most susceptible to interference, so it is advisable to adopt a large-area copper wiring method.
9. Shielded wiring cannot form a clear loop, which can create antenna effects and easily introduce interference.
10. It is best to arrange high-power devices in a relatively orderly manner, which facilitates the installation of heat sinks and the design of heat dissipation ducts.