Product Characteristics
1. Excellent Thermal Properties
High Thermal Conductivity: 20-30W/mK, effectively solving heat dissipation in high-power devices
Low CTE: 6-8ppm/℃, well matched with silicon chips (4.2ppm/℃)
High Temperature Resistance: Long-term operation at 350℃, short-term tolerance up to 500℃
2. Superior Electrical Properties
High Insulation Strength: Breakdown voltage >10kV/mm, ensuring safety in high voltage applications
Low Dielectric Loss: tanδ＜0.0002@1MHz, suitable for high frequency applications
Stable Dielectric Constant: εr=9.0-9.5, stable temperature and frequency characteristics
3. Outstanding Mechanical Properties
High Mechanical Strength: Flexural strength ≥300MPa, Mohs hardness grade 9
High Rigidity: Elastic modulus 300-400GPa, avoiding deformation
Wear and Corrosion Resistance: Resistant to acid and alkali corrosion, high surface hardness
4. Good Chemical Stability
Chemical Inertness: Does not react with most chemical reagents
Oxidation Resistance: Remains stable in high temperature air
Strong Weather Resistance: Unaffected by humid environments
5. Precision Manufacturing Features
Dimensional Stability: Controllable sintering shrinkage, accuracy up to ±0.5%
Surface Flatness: Surface roughness Ra＜0.1μm, suitable for fine line production
Metallization Capability: Various surface treatments including Mo-Mn method and gold plating
Product Application Field
1. High-Power LED Lighting
LED chip packaging: COB packaging substrates, multi-chip integrated modules
Automotive headlights: High-brightness LED headlight driver boards
Plant lighting: High-power plant growth light substrates
Outdoor lighting: Heat dissipation substrates for street lights and industrial lamps
2. Power Electronic Equipment
IGBT modules: Intelligent power module (IPM) substrates
Power controllers: High-power supply control boards
Frequency converters: Motor drive power modules
Solar inverters: Photovoltaic power conversion modules
3. Automotive Electronic Systems
New energy vehicles: Power modules for electronic control systems
Charging systems: Fast charging pile power boards
Battery management: Heat dissipation substrates for BMS systems
Vehicle power supplies: DC-DC converter modules
4. Aerospace and Military
Avionics: Heat dissipation substrates for airborne electronic equipment
Satellite systems: Power modules for satellite-borne electronic equipment
Radar systems: T/R modules for phased array radar
Missile guidance: Electronic packaging for guidance systems
5. Communication Equipment
5G base stations: Heat dissipation substrates for power amplifiers
Microwave communication: Substrates for RF power modules
Optical communication: Heat dissipation substrates for lasers
Network equipment: Power modules for high-speed switches
6. Industrial Control and Energy
Industrial frequency conversion: Control boards for high-power frequency converters
Power transmission: Power modules for smart grids
Wind power systems: Converter modules for wind power generation
Rail transit: Power modules for traction converters
7. Medical Electronic Equipment
Medical imaging: Power modules for X-ray machines and CT scanners
Surgical equipment: Power output boards for high-frequency electrosurgical units
Therapeutic equipment: Heat dissipation substrates for laser therapy devices
Monitoring equipment: Modules for high-precision monitors
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