Product Characteristics
1. Superior Thermal Performance
Ultra-High Thermal Conductivity: 170-230W/mK at room temperature, approaching the thermal conductivity of metallic aluminum
Temperature Stability: Maintains stable thermal performance over a wide temperature range (-50℃ to +300℃)
Thermal Management Advantage: Extremely low thermal resistance, effectively solving heat dissipation in high-power density devices
2. Excellent Electrical Properties
High Insulation Strength: Breakdown field strength >15kV/mm, ensuring safety and reliability in high voltage applications
Low Dielectric Constant: εr=8.5-9.0@1MHz, reducing signal transmission delay
Low Dielectric Loss: tanδ＜0.0005@1MHz, suitable for high-frequency and high-speed applications
3. Ideal Thermo-Mechanical Properties
Low CTE: 4.5-5.5ppm/℃, perfectly matched with silicon chips (4.2ppm/℃)
High Thermo-Mechanical Strength: Flexural strength 300-350MPa, Vickers hardness 1200-1400
Excellent Thermal Shock Resistance: Can withstand rapid temperature changes >800℃
4. Good Chemical Stability
Chemical Corrosion Resistance: Resistant to acid, alkali, and organic solvent erosion
Oxidation Resistance: Stable operating temperature up to 800℃ in air
Metallization Compatibility: Good bonding performance with various metals including W, Mo, and Cu
5. Environmental Adaptability
Vacuum Performance: Low outgassing rate, suitable for high vacuum environments
Radiation Resistance: Superior radiation resistance compared to other ceramic materials
Long-Term Reliability: Maintains long-term performance stability in harsh environments
Product Application Field
1. High-Power Electronic Equipment
Power electronic modules: IGBT/IPM intelligent power module substrates, new energy vehicle electronic control systems
Power conversion equipment: High-frequency high-power switching power supplies, photovoltaic inverter power modules
Industrial control systems: High-power frequency converters, motor drive controllers
Power quality equipment: Active power filters, reactive power compensation devices
2. Optoelectronics and Laser Technology
High-power lasers: Fiber laser pump sources, solid-state laser heat sinks
Laser diodes: High-power laser diode packaging substrates
Photoelectric conversion devices: Optical communication transmitter modules, photodetector packaging
Display technology: Micro-LED display mass transfer substrates
3. Microwave RF Communication
5G communication equipment: Massive MIMO antenna power amplifier modules, base station RF frontends
Microwave devices: GaN power amplifiers, microwave integrated circuit substrates
Satellite communication: Low-noise amplifiers, satellite-borne communication equipment
Radar systems: Phased array radar T/R modules, military radar systems
4. Aerospace and Defense
Avionics: Heat dissipation substrates for airborne high-power electronic equipment
Spacecraft systems: Satellite-borne computer power modules, satellite power systems
Missile systems: Guidance system electronic packaging, missile-borne computers
Electronic warfare: High-power microwave weapon systems
5. Medical Electronic Equipment
Medical imaging equipment: CT scanner X-ray tube substrates, MRI gradient amplifiers
Therapeutic equipment: Tumor radiofrequency ablation electrodes, laser therapy devices
Surgical equipment: High-frequency electrosurgical equipment, ultrasonic scalpels
Implantable devices: High-reliability implantable medical electronic devices
6. High-End Test and Measurement
Power testing: High-power electronic loads, power analyzers
High-frequency testing: Microwave test fixtures, high-frequency probe substrates
Environmental testing: High-low temperature test equipment, thermal shock test devices
7. Scientific Research Equipment
Particle accelerators: High-power RF sources, microwave power components
Nuclear fusion devices: Plasma control power systems
Synchrotron radiation: Beamline instrument equipment, X-ray optical devices
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